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The back of the card is a little less exciting, except at the top where the heat sink overlaps on the back.

The rear does not sport any 6-pin power connector as the power consumption is just 50W, which it can comfortably draw from the PCI-E slot itself. Here we have a better view of the heat sink design. I must say even though that extra fold on the back does not do anything for the thermal performance, it sure does add that cool factor to the card.
Another thing to note is that even though the heat sink is big, it does not cover the RAM chips. This was a little disappointing, as they could have covered the RAM chips too for better cooling.

With the heat sink taken off we can clearly see the core and the SAMSUNG memory modules surrounding it. The four rubber pads surrounding the core are there so that the heat sink has some support.

From this shot we can clearly see the G96 die, which is based on the same 55nm process.
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