Intel exec Pat Gelsinger says, "Today we see a clear way to get to under 10 nanometer," and it'll be within the next 10 years.
Intel exec Pat Gelsinger says, "Today we see a clear way to get to under 10 nanometer," and it'll be within the next 10 years. The next die shrink will be shown in the 32nm Westmre chips next year, followed by 14nm years after that and then the sub 10nm ones. They probably have to come up with new materials to manufacture those but we'll be looking forward to those tiny chips!
Credit:Gizmodo
indeed as the fabrication process gets further advanced millions n millions of tiny transistors can be placed on core which is more power efficient as well as much more compact, much more faster than what we have today..
its a good stride in semi-con' technology
AFAIK it is not the die size or chip size..it is the 10nm fabrication process being mentioned here that will help make the chips more and more power efficient with less heating etc..it will definitely be a plus for computing world.