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VIA Unveils C7 Processor
Techtree News Staff, May 29, 2005 1000 hrs ISTVIA Technologies has announced the VIA C7 processor based on 'Esther' core, a small, low power, secure x86 processor.
VIA Technologies has announced the VIA C7 processor family based on 'Esther' core, a small, low power, secure x86 processor.
The VIA C7 processor is targeted mainly at thin and light notebooks, mini PCs, green clients, personal electronics such as home media centers and PVRs, and high density server and server appliances that require low power, low heat, high performance and high security combination.
The VIA C7 processor idle power is as low as 100mW (0.1W), while 2.0GHz will run at about 20 watts peak power, which the company claims is an average of 40% cooler than it s competitor solutions.
IBM s 90nm System-on-Insulator (SOI) manufacturing technology provides significant performance boosts within power and thermal profiles.
Initially, to be launched at speeds of up to 2.0GHz, the VIA C7 processor has a VIA V4 bus interface with speeds of up to 800 MHz and write bandwidth and linear ordering modes, as well as SSE2 and SSE3 support for enhanced multimedia performance, and 128KB of both L1 and L2 on-die cache memory.
"With the rest of the market moving towards low power, heat efficient processor design and distributed platforms, the industry is clearly starting to follow the direction we have been championing for many years," said Wenchi Chen, president and CEO, VIA Technologies. "The VIA C7 processor will underpin our next generation platforms and enable us to maintain our leadership in driving the next wave of platform innovation."
The VIA C7 processor will enter into mass production at the end of the second quarter of this year.
The VIA C7 processor is targeted mainly at thin and light notebooks, mini PCs, green clients, personal electronics such as home media centers and PVRs, and high density server and server appliances that require low power, low heat, high performance and high security combination.
The VIA C7 processor idle power is as low as 100mW (0.1W), while 2.0GHz will run at about 20 watts peak power, which the company claims is an average of 40% cooler than it s competitor solutions.
IBM s 90nm System-on-Insulator (SOI) manufacturing technology provides significant performance boosts within power and thermal profiles.
Initially, to be launched at speeds of up to 2.0GHz, the VIA C7 processor has a VIA V4 bus interface with speeds of up to 800 MHz and write bandwidth and linear ordering modes, as well as SSE2 and SSE3 support for enhanced multimedia performance, and 128KB of both L1 and L2 on-die cache memory.
"With the rest of the market moving towards low power, heat efficient processor design and distributed platforms, the industry is clearly starting to follow the direction we have been championing for many years," said Wenchi Chen, president and CEO, VIA Technologies. "The VIA C7 processor will underpin our next generation platforms and enable us to maintain our leadership in driving the next wave of platform innovation."
The VIA C7 processor will enter into mass production at the end of the second quarter of this year.
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Karamchand
,Nasik, on Jan 04, 2006 12:23 PM
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