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AMD roars Tigris, Congo Platforms for Notebooks
Techtree News Staff, Sep 14, 2009 1744 hrs ISTTigris arrives for mainstream notebooks, Congo for ultra thin notebooks
Last weekend, AMD unveiled two new mobile platforms for notebooks - Tigris and Congo. The Tigris platform arrives for mainstream notebooks packing full 1080p HD (Blu-ray) play back and 25 percent more battery life. The Congo platform is meant for the ultra thin notebooks offering multi-core performance, dual-channel memory controller and 800MHz hyper-transport link. Notebooks based on both platforms are expected to be made available during the time of Windows 7 launch on Oct 22.
AMD mentioned the Tigris platform for mainstream notebook when they showed off the roadmap last November. Tigris is a successor to the Puma platform, and will accommodate 45nm Caspian CPU with AMD 780M chipset. The 45nm Caspian CPU will come in single-core and dual-core wafers with 2MB cache.
In mid-April, AMD's notebook roadmap leaked out clearly showing details about the Tigris platform for the mainstream. For this platform, an AMD 780M chipset bearing AMD RS880M series north bridge chip and AMD SB710 south bridge chip would be released. This platform supports DirectX 10.1, UVD 2.0, ATI Avivo HD, PowerPlay and offload video encoding to Radeon HD 4200 series GPU.
AMD spokesperson Bob Grim told TG Daily, "The mainstream notebook platform facilitates a 25 percent battery life increase in comparison with previous AMD mobile platforms." Tigris has Star family processors dubbed Turion II. These new processors have Thermal Design Power rating of 35W that include dual-core 2.6GHz Turion II to single core 2GHz Sempron CPU with 25W TDP.
Also, the new Congo platform for ultra thin notebooks arrived that will compete with Intel's Consumer Ultra Low Voltage CPUs. The Congo platform offers same 1080p HD playback, DirectX 10.1 support and longer battery life. AMD's Congo platform has power efficient M780G chipset coupled with single-core and dual-core processors with TDP of 18W or less.
The Congo platform has dual-core Conesus processors with 64-bit support like 1.6GHz Turion Neo X2 with TDP of 18W to 1.5GHz Sempron chip with TDP of 15W. Conesus processors, however, would come from the 65nm silicon chip manufacturing technology.
AMD has also announced new VISION technology which basically involves bundling the hardware in the low-end/low power, mainstream or high-end level. VISION will communicate to system and give a superior visual output with help of combined CPU and GPU processing power. Depending upon the different usage pattern of consumers VISION is divided in three levels: Vision, Vision Premium and Vision Ultimate. Check out AMD VISION home page for more details.
AMD mentioned the Tigris platform for mainstream notebook when they showed off the roadmap last November. Tigris is a successor to the Puma platform, and will accommodate 45nm Caspian CPU with AMD 780M chipset. The 45nm Caspian CPU will come in single-core and dual-core wafers with 2MB cache.
In mid-April, AMD's notebook roadmap leaked out clearly showing details about the Tigris platform for the mainstream. For this platform, an AMD 780M chipset bearing AMD RS880M series north bridge chip and AMD SB710 south bridge chip would be released. This platform supports DirectX 10.1, UVD 2.0, ATI Avivo HD, PowerPlay and offload video encoding to Radeon HD 4200 series GPU.
AMD spokesperson Bob Grim told TG Daily, "The mainstream notebook platform facilitates a 25 percent battery life increase in comparison with previous AMD mobile platforms." Tigris has Star family processors dubbed Turion II. These new processors have Thermal Design Power rating of 35W that include dual-core 2.6GHz Turion II to single core 2GHz Sempron CPU with 25W TDP.
Also, the new Congo platform for ultra thin notebooks arrived that will compete with Intel's Consumer Ultra Low Voltage CPUs. The Congo platform offers same 1080p HD playback, DirectX 10.1 support and longer battery life. AMD's Congo platform has power efficient M780G chipset coupled with single-core and dual-core processors with TDP of 18W or less.
The Congo platform has dual-core Conesus processors with 64-bit support like 1.6GHz Turion Neo X2 with TDP of 18W to 1.5GHz Sempron chip with TDP of 15W. Conesus processors, however, would come from the 65nm silicon chip manufacturing technology.
AMD has also announced new VISION technology which basically involves bundling the hardware in the low-end/low power, mainstream or high-end level. VISION will communicate to system and give a superior visual output with help of combined CPU and GPU processing power. Depending upon the different usage pattern of consumers VISION is divided in three levels: Vision, Vision Premium and Vision Ultimate. Check out AMD VISION home page for more details.
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